12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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1 12500 TI Boulevard, MS 8640, Dallas, Texas PCN# Qualification of Cu as Alternative Wire Base Metal for Selected Device(s) Change Notification / Sample Request Date: 1/22/2014 To: Newark/Farnell PCN Dear Customer: This is an announcement of a change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. We request you acknowledge receipt of this notification within 30 days of the date of this notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change. If you require samples or additional data to support your evaluation, please request within 30 days. The changes discussed within this PCN will not take effect any earlier than 90 days from the date of this notification, unless customer agreement has been reached on an earlier implementation of the change. This notification period is per TI s standard process. This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager (PCN_ww_admin_team@list.ti.com). Sincerely, PCN Team SC Business Services Phone: +1(214) Fax: +1(214)
2 Attachment: 1 Products Affected: The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available. DEVICE SN74LVC1G06DBVR SN74LVC1G14DBVR SN74AHC1G04DBVR SN74AHC1G08DBVR SN74AHC1G125DBVR SN74AHC1G32DBVR SN74AHC1G86DBVR SN74AHCT1G04DBVR SN74AHCT1G08DBVR SN74AHCT1G08DBVT SN74AHCT1G125DBVR SN74AHCT1G125DBVT SN74CB3T1G125DBVR SN74LVC1G00DBVR SN74LVC1G02DBVR SN74LVC1G07DBVR SN74LVC1G07DBVT SN74LVC1G11DBVR SN74LVC1G126DBVR SN74LVC1G17DBVR SN74LVC1G240DBVR SN74LVC1G3157DBVR SN74LVC1G32DBVR SN74LVC1G332DBVR SN74LVC1G80DBVR SN74LVC1GU04DBVR SN74LVC2G04DBVR SN74LVC2G07DBVR SN74LVC2G14DBVR SN74LVC2G17DBVR SN74LVC2G34DBVR TS5A3166DBVR TS5A3167DBVR UCC3895PW SN74AHC1G02DBVR SN74AHC1G02DBVT SN74AHC1G08DBVT SN74AHC1G126DBVR SN74AHC1G86DBVT SN74AHCT1G02DBVT SN74AHCT1G126DBVT SN74AHCT1G32DBVR SN74AHCT1G86DBVT SN74LVC1G126DBVT SN74LVC1G14DBVT SN74LVC1G17DBVT SN74LVC1G240DBVT SN74LVC1G32DBVT SN74LVC1G79DBVT SN74LVC1G80DBVT SN74LVC1G86DBVR CUSTOMER PART NUMBER
3 SN74LVC1G86DBVT SN74LVC2G04DBVT SN74LVC2G14DBVT SN74LVC2G17DBVT TS5A1066DBVR SN74AHC1G09DBVR SN74AHC1G125DBVT SN74AHC1G126DBVT SN74AHC1G32DBVT SN74AHC1GU04DBVR SN74AHCT1G00DBVR SN74AHCT1G00DBVT SN74AHCT1G04DBVT SN74AHCT1G126DBVR SN74AHCT1G86DBVR SN74AUC1G17DBVR SN74AUP1G04DBVT SN74AUP1G08DBVR SN74AUP1G17DBVR SN74AUP1G17DBVT SN74LVC1G00DBVT SN74LVC1G02DBVT SN74LVC1G06DBVT SN74LVC1G27DBVR SN74LVC1G79DBVR SN74LVC1GU04DBVT Technical details of this Product Change follow on the next page(s).
4 PCN Number: PCN Date: 01/22/2014 Title: Customer Contact: Qualification of Cu as Alternative Wire Base Metal for Selected Device(s) PCN Manager Phone: +1(214) Dept: Quality Services Proposed 1 st Ship Date: 04/22/2014 Estimated Sample Availability: Date provided at sample request Change Type: Assembly Site Assembly Process Assembly Materials Design Electrical Specification Mechanical Specification Test Site Packing/Shipping/Labeling Test Process Wafer Bump Site Wafer Bump Material Wafer Bump Process Wafer Fab Site Wafer Fab Materials Wafer Fab Process Part number change PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option for devices listed in Product affected section below. Material differences are shown in the following table: Group 1 Device: Devices will remain in current assembly facility From To Wire type Au Cu Mold Compound R-13 R-17 Leadframe Finish NiPdAu Matte Sn Upon expiration of this PCN, TI will combine lead free solutions in a single standard part number, for example; SN001066DBVR can ship with both Matte Sn and NiPdAu. Group 2 Device: MLA as additional Assembly and Test Site CAR MLA Wire type Au Cu Mold Compound Test coverage, insertions, conditions will remain consistent with current testing and verified with test MQ. Reason for Change: Continuity of supply. 1) To align with world technology trends and use wiring with enhanced mechanical and electrical properties 2) Maximize flexibility within our Assembly/Test production sites. 3) Cu is easier to obtain and stock
5 Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None. Changes to product identification resulting from this PCN: Group 1 Device: Devices will remain in current assembly facility ECAT: G4 = NiPdAu ECAT: G3 = Matte Sn Assembly Site NFME Assembly Site Origin (22L) ASO:NFME ECAT:G4 NFME Assembly Site Origin (22L) ASO: NFME ECAT:G3 Sample product shipping label to show code location only (not actual product label) Group 2 Device: CAR to MLA Assembly Site CARSEM Malaysia Assembly Site Origin (22L) ASO: CAR TI Malaysia Assembly Site Origin (22L) ASO: MLA ASSEMBLY SITE CODES: CAR = V, MLA = K Sample product shipping label (not actual product label)
6 Product Affected: Group 1 Device SN001066DBVR SN74AHCT1G04DBVT SN74AUP1G17DBVT SN74LVC1G332DBVR SN003166DBVR SN74AHCT1G08DBVR SN74AUP1G97DBVR SN74LVC1G79DBVR SN74AHC1G02DBVR SN74AHCT1G08DBVT SN74CB3T1G125DBVR SN74LVC1G79DBVT SN74AHC1G02DBVT SN74AHCT1G125DBVR SN74LVC1G00DBVR SN74LVC1G80DBVR SN74AHC1G04DBVR SN74AHCT1G125DBVT SN74LVC1G00DBVT SN74LVC1G80DBVT SN74AHC1G04DBVT SN74AHCT1G126DBVR SN74LVC1G02DBVR SN74LVC1G86DBVR SN74AHC1G08DBVR SN74AHCT1G126DBVT SN74LVC1G02DBVT SN74LVC1G86DBVT SN74AHC1G08DBVT SN74AHCT1G32DBVR SN74LVC1G06DBVR SN74LVC1GU04DBVR SN74AHC1G09DBVR SN74AHCT1G32DBVT SN74LVC1G06DBVT SN74LVC1GU04DBVT SN74AHC1G125DBVR SN74AHCT1G86DBVR SN74LVC1G07DBVR SN74LVC2G04DBVR SN74AHC1G125DBVT SN74AHCT1G86DBVT SN74LVC1G07DBVT SN74LVC2G04DBVT SN74AHC1G126DBVR SN74AUC1G00DBVR SN74LVC1G11DBVR SN74LVC2G07DBVR SN74AHC1G126DBVT SN74AUC1G07DBVR SN74LVC1G126DBVR SN74LVC2G14DBVR SN74AHC1G32DBVR SN74AUC1G07DBVT SN74LVC1G126DBVT SN74LVC2G14DBVT SN74AHC1G32DBVT SN74AUC1G14DBVR SN74LVC1G14DBVR SN74LVC2G17DBVR SN74AHC1G86DBVR SN74AUC1G17DBVR SN74LVC1G14DBVT SN74LVC2G17DBVT SN74AHC1G86DBVT SN74AUC1G32DBVR SN74LVC1G17DBVR SN74LVC2G34DBVR SN74AHC1GU04DBVR SN74AUC1G66DBVR SN74LVC1G17DBVT SN74LVC2G34DBVT SN74AHC1GU04DBVT SN74AUC2G07DBVR SN74LVC1G240DBVR TS5A1066DBVR SN74AHCT1G00DBVR SN74AUP1G04DBVR SN74LVC1G240DBVT TS5A3166DBVR SN74AHCT1G00DBVT SN74AUP1G04DBVT SN74LVC1G27DBVR TS5A3167DBVR SN74AHCT1G02DBVR SN74AUP1G07DBVR SN74LVC1G3157DBVR TS5A63157DBVR SN74AHCT1G02DBVT SN74AUP1G08DBVR SN74LVC1G32DBVR SN74AHCT1G04DBVR SN74AUP1G17DBVR SN74LVC1G32DBVT Product Affected: Group 2 Device UCC3895PW UCC3895PWG4 UCC3895PWTR UCC3895PWTRG4 Qualification Data : Group 1 This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1 : TL432ACDBVR (MSL 1-260C) Assembly Site: NFME Mold Compound: R-17 # Pins-Designator, Family: 5-DBV, SOT-23 Mount Compound: A-03 Lead frame (Finish, Base): Matte Sn, Cu Bond Wire: 1.0 Mil Dia., Cu
7 Electrical Characterization - Pass - - **Unbiased HAST 130C/85%RH/33.3 psia (96 hrs) 77/0 77/0 77/0 **High Temp. Storage Bake 170C (600 hrs) 77/0 77/0 77/0 **Autoclave 121C (192 hrs) 77/0 77/0 77/0 **Biased HAST 130C/85%RH (192 hrs) 77/0 77/0 77/0 **Life Test 150C (300 hrs) 77/0 77/0 77/0 Solderability Steam age, 8 hours; PB-Free solder 22/0 22/0 22/0 X-ray (top side only) 5/0 5/0 5/0 Flammability (IEC ) 5/0 5/0 - Flammability (UL-1694) 5/0 5/0 - Flammability UL 94V-0) 5/0 5/0 - Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 Notes **- Preconditioning sequence: Level 1-260C. Qual Vehicle 2 : TS321IDBVR (MSL 1-260C) Assembly Site: NFME Mold Compound: R-17 # Pins-Designator, Family: 5-DBV, SOT-23 Mount Compound: A-03 Lead frame (Finish, Base): Matte Sn, Cu Bond Wire: 1.0 Mil Dia., Cu Electrical Characterization - Pass - - **Unbiased HAST 130C/85%RH/33.3 psia (192 hrs) 77/0 77/0 77/0 **High Temp. Storage Bake 170C (600 hrs) 77/0 77/0 77/0 **Autoclave 121C (192 hrs) 77/0 77/0 77/0 **Life Test 150C (300 hrs) 77/0 - - Solderability Steam age, 8 hours; PB-Free solder 22/0 - - X-ray (top side only) 5/0 5/0 5/0 Flammability (IEC ) 5/0 - - Flammability (UL-1694) 5/0 - - Flammability UL 94V-0) 5/0 - - Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 Notes **- Preconditioning sequence: Level 1-260C.
8 Qual Vehicle 3 : INA193AIDBVR (MSL 2-260C) Assembly Site: NFME Mold Compound: R-17 # Pins-Designator, Family: 5-DBV, SOT-23 Mount Compound: A-03 Lead frame (Finish, Base): Matte Sn, Cu Bond Wire: 1.0 Mil Dia., Cu Lot# 1 Lot# 2 Electrical Characterization - 10/0 - **Unbiased HAST 130C/85%RH/33.3 psia (96 hrs) 77/0 77/0 **Biased HAST 130C/85%RH (192 hrs) 77/0 77/0 **T/C -65C/150C -65C/+150C (500 Cyc) 77/0 77/0 **High Temp. Storage Bake 150C (500 hrs) 77/0 77/0 Manufacturability (Assembly) (per mfg. Site specification) Pass Pass Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 Qual Vehicle 4 : TMP121AIDBVR (MSL 2-260C) Assembly Site: NFME Mold Compound: R-17 # Pins-Designator, Family: 6-DBV, SOT-23 Mount Compound: A-03 Lead frame (Finish, Base): Matte Sn, Cu Bond Wire: 1.0 Mil Dia., Cu Lot# 1 Lot# 2 Electrical Characterization - 10/0 - **Unbiased HAST 130C/85%RH/33.3 psia (96 hrs) 77/0 77/0 **Biased HAST 130C/85%RH (192 hrs) 77/0 77/0 **T/C -65C/150C -65C/+150C (500 Cyc) 77/0 77/0 **High Temp. Storage Bake 150C (500 hrs) 77/0 77/0 X-ray (top side only) 5/0 5/0 Manufacturability (Assembly) (per mfg. Site specification) Pass Pass Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0
9 Qual Vehicle 5 : TPD4E001DBVR (MSL 1-260C) Assembly Site: NFME Mold Compound: R-17 # Pins-Designator, Family: 6-DBV, SOT-23 Mount Compound: A-03 Lead frame (Finish, Base): Matte Sn, Cu Bond Wire: 1.0 Mil Dia., Cu **Unbiased HAST 130C/85%RH/33.3 psia (192 hrs) 77/0 77/0 77/0 **Biased HAST 130C/85%RH (192 hrs) 77/0 77/0 77/0 **T/C -65C/150C -65C/+150C (1000 Cyc) 77/0 77/0 77/0 **High Temp. Storage Bake 150C (1000 hrs) 77/0 77/0 - X-ray (top side only) 5/0 5/0 5/0 Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 Notes **- Preconditioning sequence: Level 1-260C. Qualification Data : Group 2 This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1 : BQ29330DBT (MSL 2-260C) Assembly Site: MLA Mold Compound: # Pins-Designator, Family: 30-DBT, TSSOP Mount Compound: Lead frame (Finish, Base): NiPdAu, Cu Bond Wire: 0.96 Mil Dia., Cu Electrical Characterization - Pass - - ** Thermal Shock -65/150C -65C/+150C (500 Cyc) 77/0 77/0 77/0 **High Temp. Storage Bake 170C (420 hrs) 77/0 77/0 77/0 **Autoclave 121C (96 hrs) 77/0 77/0 77/0
10 Qual Vehicle 2 : ADS1230IPW (MSL 2-260C) Assembly Site: MLA Mold Compound: # Pins-Designator, Family: 16-PW, TSSOP Mount Compound: Lead frame (Finish, Base): NiPdAu, Cu Bond Wire: 0.96 Mil Dia., Cu ** Thermal Shock -65/150C -65C/+150C (500 Cyc) 77/0 77/0 77/0 **High Temp. Storage Bake 170C (420 hrs) 77/0 77/0 77/0 **Autoclave 121C (384 hrs) 77/0 77/0 77/0 Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 Qual Vehicle 3 : CDCVF2505PW (MSL 1-260C) Assembly Site: MLA Mold Compound: # Pins-Designator, Family: 8-PW, TSSOP Mount Compound: Lead frame (Finish, Base): NiPdAu, Cu Bond Wire: 0.96 Mil Dia., Cu ** Thermal Shock -65/150C -65C/+150C (500 Cyc) 77/0 77/0 77/0 **High Temp. Storage Bake 170C (420 hrs) 77/0 77/0 77/0 **Autoclave 121C (96 hrs) 77/0 77/0 77/0 Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 Notes **- Preconditioning sequence: Level 1-260C. Qual Vehicle 4 : SN75LVDS84ADGG (MSL 2-260C) Assembly Site: MLA Mold Compound: # Pins-Designator, Family: 48-DGG, TSSOP Mount Compound: Lead frame (Finish, Base): NiPdAu, Cu Bond Wire: 0.96 Mil Dia., Cu **Unbiased HAST 130C/85%RH (192 hrs) 77/0 77/0 77/0 ** Thermal Shock -65/150C -65C/+150C (500 Cyc) 77/0 77/0 77/0 Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0
11 Qual Vehicle 5 : THS7303PW (MSL 2-260C) Assembly Site: MLA Mold Compound: # Pins-Designator, Family: 20-PW, TSSOP Mount Compound: Lead frame (Finish, Base): NiPdAu, Cu Bond Wire: 0.96 Mil Dia., Cu **High Temp. Storage Bake 170C (1000 hrs) 77/0 77/0 77/0 **Autoclave 121C (384 hrs) 77/0 77/0 77/0 ** Thermal Shock -65/150C -65C/+150C (500 Cyc) 77/0 77/0 77/0 Moisture Sensitivity (level 260C peak +5/-0C) 12/0 12/0 12/0 For questions regarding this notice, s can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com
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