Zero Defects Lead Free Soldering
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1 STEP Presentation, 11/3/01 Zero Defects Lead Free Soldering Dr. Sammy Shina University of Massachusetts Lowell UMASS Lowell Consortium
2 Current Consensus: There is no drop-in Lead Free replacement for lead soldering The Problem Lead is a toxic material: Past major replacements paint, gasoline and joining metal piping Tin-Lead eutectic solder (63/37) used in electronics industry for more than 50 years large installed manufacturing base history of reliability data Major Companies formed NEMI to share resources and recommend alternatives, $15,000 access to information
3 Lead Free Drivers Environmental European Parliament and Council Directive on Waste Electrical and Electronic Equipment Directive (WEEE) Bans lead from certain electronic applications by 2008 Japan Japanese Electronics Recycling Law Forbids companies toxic elements that leach into landfills 2/3rd reduction by 2004
4 Lead Free Drivers Market Pressure German Bluebird Proactive stance on lead-free issue by Japanese OEMs Hitachi Reduced lead usage by 50% since 1997 All products lead-free by 2001 current investment US $11.2 million Similar stands by Sony, Panasonic, NEC, Toshiba and Fujitsu Lead-free green tagged products already in market in Europe and Japan Claims of increased market share by 12% US market anticipated to be flooded by the end of 2002
5 Lead Free Project Objectives Investigate safe, reliable, non-toxic and cost effective substitute Understand material properties compatibility of manufacturing processes and equipment long term availability and solder joint reliability. Identify Roadblocks Select Test Methods Develop a standard guideline SMT Process Optimization Implementation of Lead-Free Process
6 Project Team UMASS Lowell-Industry Lead Free Consortium
7 Project Team UMASS Lowell-Industry Lead Free Consortium Dr. Sammy Shina; Dept. of Mechanical Engineering, University of Massachusetts, Lowell. L. Harriman, C. Pace, Toxic Use Reduction Institute C. Pace, STEP Program K. Walters, BTU International, North Billerica, MA. T. Bresnan, Hadco Corporation, Ward Hill, MA. T. Skidmore, Multicore Solders, Richardson, Texas. D. Pinsky, Raytheon Corporation, Lexington, MA. P. Provencal, Solectron Corporation, Westborough, MA. D. Abbot, Texas Instruments, Attleboro, MA M. Quealy, Schnieder Automation, Andover, MA G. Wilkish and B. Anderson, MACOM, Lowell MA.
8 UMass Team " This is the most systematic approach to lead free electronics assembly, that I have come across. Work initiated by UMass Lowell team is a positive step towards lead free process optimization." Alan Rae Director of Technology Cookson Electronics
9 Test Factors (source) Solder Alloys (Multicore solders) Sn/Ag/Cu(95.5/3.8/0.7) Sn/Ag (96.5/3.5) Sn/Bi (57/43) PWB Surface Finishes (HADCO) OSP(Organic Solder Protectants) Electroless Nickel Immersion Gold (ENIG) Thermal Profiles (BTU) Soak with 60sec, 90sec, 120sec above liquidus temp. Linear with 60sec, 90sec, 120sec above liquidus temp. Reflow Environment (Solectron) Nitrogen vs. Air reflow.
10 Test Vehicle: ( Lead free components) Passives Qty Qty Qty 27 FR-4 size: 5.5 x4.0 IC/Semiconductor LQFP Pitch - Qty 2 LQFP Pitch - Qty 2 SO14 - Qty 3 SO16 - Qty 3
11 Visual Inspection Lead Free Defect Results Sl.no. Paste S. Finish TAL Soak Nitrogen Board Label Profile No.Board Faults Visual Total Average 1 Sn/Ag/Cu OSP 60sec Yes yes 1A 1B Sn/Ag/Cu OSP 90sec No No 2A 2B Sn/Ag/Cu OSP 120sec No yes 3A 3B Sn/Ag/Cu ENIG 60sec No No 4A 4B Sn/Ag/Cu ENIG 90sec No yes 5A 5B Sn/Ag/Cu ENIG 120sec Yes yes 6A 6B Sn/Ag/Cu OSP 60sec No yes 7A 7B Sn/Ag/Cu OSP 90sec Yes yes 8A 8B Sn/Ag/Cu OSP 120 No No 9A 9B Sn/Bi OSP 60sec No yes 10A 10B Sn/Bi OSP 90sec No yes 11A 11B Sn/Bi OSP 120sec Yes No 12A 12B Sn/Bi ENIG 60sec No yes 13A 13B Sn/Bi ENIG 90sec Yes No 14A 14B Sn/Bi ENIG 120sec No yes 15A 15B Sn/Bi OSP 60sec Yes No 16A 16B Sn/Bi OSP 90sec No yes 17A 17B Sn/Bi OSP 120sec No yes 18A 18B Sn/Ag OSP 60sec No No 19A 19B Sn/Ag OSP 90sec Yes yes 20A 20B Sn/Ag OSP 120sec No yes 21A 21B Sn/Ag ENIG 60sec Yes yes 22A 22B Sn/Ag ENIG 90sec No yes 23A 23B Sn/Ag ENIG 120sec No No 24A 24B Sn/Ag OSP 60sec No yes 25A 25B Sn/Ag OSP 90sec No No 26A 26B Sn/Ag OSP 120sec Yes yes 27A 27B
12 Reliability Test Theoretical Thermal Cycling 120 Ramp 10 C/min Dwell time(20 min.) Temperature in C
13 Pull Test on Ni/Pd SO14 Lead-Free Results after Thermal Cycling Paste S. Finish TAL Soak N2 Board Label Force (lbs) Force (N) Average 1 Sn/Ag/Cu OSP 60sec Yes yes 1A 1B Sn/Ag/Cu OSP 90sec No No 2A 2B Sn/Ag/Cu OSP 120sec No yes 3A 3B Sn/Ag/Cu ENIG 60sec No No 4A 4B Sn/Ag/Cu ENIG 90sec No yes 5A 5B Sn/Ag/Cu ENIG 120sec Yes yes 6A 6B Sn/Ag/Cu OSP 60sec No yes 7A 7B Sn/Ag/Cu OSP 90sec Yes yes 8A 8B Sn/Ag/Cu OSP 120 No No 9A 9B Sn/Bi OSP 60sec No yes 10A 10B Sn/Bi OSP 90sec No yes 11A 11B Sn/Bi OSP 120sec Yes No 12A 12B Sn/Bi ENIG 60sec No yes 13A 13B Sn/Bi ENIG 90sec Yes No 14A 14B Sn/Bi ENIG 120sec No yes 15A 15B Sn/Bi OSP 60sec Yes No 16A 16B Sn/Bi OSP 90sec No yes 17A 17B Sn/Bi OSP 120sec No yes 18A 18B Sn/Ag OSP 60sec No No 19A 19B Sn/Ag OSP 90sec Yes yes 20A 20B Sn/Ag OSP 120sec No yes 21A 21B Sn/Ag ENIG 60sec Yes yes 22A 22B Sn/Ag ENIG 90sec No yes 23A 23B Sn/Ag ENIG 120sec No No 24A 24B Sn/Ag OSP 60sec No yes 25A 25B Sn/Ag OSP 90sec No No 26A 26B
14 Pull Test - MIN Before and After Thermal SnAgCu SnBi SnAg OSP ENIG OSP N Air Cycling N Soak Linear Linear Pb OSP Pb ENIG Solder Finish Environment TAL Soak Baseline
15 Conclusions For Zero Defect lead Lead Free Soldering and superior long term Joint Strength, use the following: Materials Lead Free Solder : Sn/Ag/Cu Surface Finish for PWB: ENIG Components Finish: Ni/Pd Processes Reflow Profile: Linear Reflow Environment: Nitrogen Time Above Liquidus: 120 seconds
16 Dissemination 17 Presentations, including 4 TURI Sponsored Workshops in MA 2 State of MA committees 6 Society Conferences: IMAPS, SMTA, APEX, TMS 2 Electronics Conferences: APEX, ETRONIX 1 book chapter 2 Papers Translated into Chinese and Japanese Presentations in MA, GA, IL, CA, LA.
17 Future Work Consortium Working on 2nd phase: Materials New flux combinations with Sn/Ag/Cu More component types (BGA, QFP s) More Component finishes (Sn, SOP, Immersion) More lead free PWB surface finishes Processes Reflow Environment: %Nitrogen or Air Benchmarked with Sn/Pb Lead materials Base
18 Cross Section of Zero Defect Test PWB 10X Mag
Zero Defects Lead Free Soldering
SMTA 2001 Zero Defects Lead Free Soldering Dr. Sammy Shina University of Massachusetts Lowell UMASS Lowell Consortium About the Author Dr. Sammy G. Shina, Sam Shina, PE, BSEE, BSM, MSCS, PhD, 19 Swanson
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