Zero Defects Lead Free Soldering
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1 SMTA 2001 Zero Defects Lead Free Soldering Dr. Sammy Shina University of Massachusetts Lowell UMASS Lowell Consortium
2 About the Author Dr. Sammy G. Shina, Sam Shina, PE, BSEE, BSM, MSCS, PhD, 19 Swanson Rd., Framingham, MA 01701, is the associate professor of Mechanical Engineering at the University of Lowell, College of Engineering. Professor Shina has spent 32 years in High Technology Companies developing new products and state of the art manufacturing. His experience range from the process design and management of Automatic Printed Circuit Board (PCB) Fabrication, assembly and test; the introduction and management of CAE/CAD/CIM and manufacturing link processes. He is a graduate of MIT, Tufts and WPI. H (508) W (508) Fax (508) sammy_shina@uml.edu
3 Project Team UMASS Lowell-Industry Lead Free Consortium
4 Project Team UMASS Lowell-Industry Lead Free Consortium Dr. Sammy Shina; Dept. of Mechanical Engineering, University of Massachusetts, Lowell. L. Harriman, C. Pace, Toxic Use Reduction Institute C. Pace, STEP Program K. Walters, BTU International, North Billerica, MA. T. Bresnan, Hadco Corporation, Ward Hill, MA. T. Skidmore, Multicore Solders, Richardson, Texas. D. Pinsky, Raytheon Corporation, Lexington, MA. P. Provencal, Solectron Corporation, Westborough, MA. D. Abbot, Texas Instruments, Attleboro, MA M. Quealy, Scnieder Automation, Andover, MA G. Wilkish and B. Anderson, MACOM, Lowell MA.
5 Umass Team " This is the most systematic approach to lead free electronics assembly, that I have come across. Work initiated by UMass Lowell team is a positive step towards lead free process optimization." Alan Rae Director of Technology Cookson Electronics
6 Experimental setup Lead Free: 54 Printed Wiring Boards (PWB s) Two lead free surface finishes. Lead free components. lead free solders. Design of experiments; DoE Orthogonal array L27. one replication; 54 experiments total. Baseline: 12 Printed Wiring Boards (PWB s) Two lead free surface finish Lead finish components Tin/Lead Solder
7 Test Factors (source) Solder Alloys (Multicore solders) Sn/Ag/Cu(95.5/3.8/0.7) Sn/Ag (96.5/3.5) Sn/Bi (57/43) PWB Surface Finishes (HADCO) OSP(Organic Solder Protectants) Electroless Nickel Immersion Gold (ENIG) Thermal Profiles (BTU) Soak with 60sec, 90sec, 120sec above liquidus temp. Linear with 60sec, 90sec, 120sec above liquidus temp. Reflow Environment (Solectron) Nitrogen vs. Air reflow.
8 Soak Profile (Sn/Ag/Cu with 120 sec above liquidus temp.)
9 Linear Profile (Sn/Ag/Cu with 120 sec above liquidus temp.)
10 Test Vehicle: ( Lead free components) Passives Qty Qty Qty 27 FR-4 size: 5.5 x4.0 IC/Semiconductor LQFP Pitch - Qty 2 LQFP Pitch - Qty 2 SO14 - Qty 3 SO16 - Qty 3
11 Visual Inspection Wetting Performance
12 Visual Inspection Lead Free Defect Results Sl.no. Paste S. Finish TAL Soak Nitrogen Board Label Profile No.Board Faults Visual Total Average 1 Sn/Ag/Cu OSP 60sec Yes yes 1A 1B Sn/Ag/Cu OSP 90sec No No 2A 2B Sn/Ag/Cu OSP 120sec No yes 3A 3B Sn/Ag/Cu ENIG 60sec No No 4A 4B Sn/Ag/Cu ENIG 90sec No yes 5A 5B Sn/Ag/Cu ENIG 120sec Yes yes 6A 6B Sn/Ag/Cu OSP 60sec No yes 7A 7B Sn/Ag/Cu OSP 90sec Yes yes 8A 8B Sn/Ag/Cu OSP 120 No No 9A 9B Sn/Bi OSP 60sec No yes 10A 10B Sn/Bi OSP 90sec No yes 11A 11B Sn/Bi OSP 120sec Yes No 12A 12B Sn/Bi ENIG 60sec No yes 13A 13B Sn/Bi ENIG 90sec Yes No 14A 14B Sn/Bi ENIG 120sec No yes 15A 15B Sn/Bi OSP 60sec Yes No 16A 16B Sn/Bi OSP 90sec No yes 17A 17B Sn/Bi OSP 120sec No yes 18A 18B Sn/Ag OSP 60sec No No 19A 19B Sn/Ag OSP 90sec Yes yes 20A 20B Sn/Ag OSP 120sec No yes 21A 21B Sn/Ag ENIG 60sec Yes yes 22A 22B Sn/Ag ENIG 90sec No yes 23A 23B Sn/Ag ENIG 120sec No No 24A 24B Sn/Ag OSP 60sec No yes 25A 25B Sn/Ag OSP 90sec No No 26A 26B Sn/Ag OSP 120sec Yes yes 27A 27B
13 Visual Inspection Visual Inspection Lead Free Defect Results OSP ENIG OSP N Air N Soak Y Linear Linear PB OSP Pb ENI SnAgCu SnBi SnAG
14 Visual Inspection Tin/Lead Baseline Defect Results Tin/Lead Baseline: Sl.no. Board S.Finish N2 Defects 1 Pb1 OSP N Pb2 OSP N Pb3 OSP N Pb4 OSP air Pb5 OSP air Pb6 OSP air Pb7 ENIG N2 0 8 Pb8 ENIG N2 0 9 Pb9 ENIG N Pb10 ENIG air Pb11 ENIG air 0 12 Pb12 ENIG air 30
15 Visual Inspection Anova Analysis Column Factors DOF SS Variance F-ratio SS' % 1 Solder Paste 2 611, , , Surface Finish 2 4,412, ,206, ,398, &4 Paste X S.Finish 4 1,887, , ,859, Time above Liquidus 2 61, , , &7 Paste X TAL 4 83, , , Soak Pooled Pooled 10 Nitrogen (Env.) 2 909, , , &11 S.Finish X TAL 4 148, , , Not used Pooled Pooled 13 Not used Pooled Pooled Replication , , , Total 53 8,343, ,343,
16 Pull Test on Ni/Pd SO14 Setup on Instron/ 45 is more desirable (+shear)
17 Pull Test on Ni/Pd SO14 Lead-Free Results Paste S. Finish TAL Soak N2 Board Label Force (lbs) Force (N) Average Sn/Ag/Cu OSP 60sec Yes yes 1A 1B Sn/Ag/Cu OSP 90sec No No 2A 2B Sn/Ag/Cu OSP 120sec No yes 3A 3B Sn/Ag/Cu ENIG 60sec No No 4A 4B Sn/Ag/Cu ENIG 90sec No yes 5A 5B Sn/Ag/Cu ENIG 120sec Yes yes 6A 6B Sn/Ag/Cu OSP 60sec No yes 7A 7B Sn/Ag/Cu OSP 90sec Yes yes 8A 8B Sn/Ag/Cu OSP 120 No No 9A 9B Sn/Bi OSP 60sec No yes 10A 10B Sn/Bi OSP 90sec No yes 11A 11B Sn/Bi OSP 120sec Yes No 12A 12B Sn/Bi ENIG 60sec No yes 13A 13B Sn/Bi ENIG 90sec Yes No 14A 14B Sn/Bi ENIG 120sec No yes 15A 15B Sn/Bi OSP 60sec Yes No 16A 16B Sn/Bi OSP 90sec No yes 17A 17B Sn/Bi OSP 120sec No yes 18A 18B Sn/Ag OSP 60sec No No 19A 19B Sn/Ag OSP 90sec Yes yes 20A 20B Sn/Ag OSP 120sec No yes 21A 21B Sn/Ag ENIG 60sec Yes yes 22A 22B Sn/Ag ENIG 90sec No yes 23A 23B Sn/Ag ENIG 120sec No No 24A 24B Sn/Ag OSP 60sec No yes 25A 25B Sn/Ag OSP 90sec No No 26A 26B Sn/Ag OSP 120sec Yes yes 27A 27B
18 Visual + Pull Conclusions ors Visual test Percent contribution towards the variation of visual defects Pull test Percent contribution towards the variation of pull strength Overall conclusion er Paste Alloy Sn/Ag/Cu 7.16% Sn/Ag/Cu 42.89% Sn/Ag/Cu or Sn/Ag ponent Finsh Ni/Pd N/A SO14 N/A Ni/PD only Surface Finish ENIG 52.71% OSP 7.43% ENIG rmal Profile N/A N/A Linear 3.18% Linear e Above Liquidus 120 sec 0.57% N/A N/A 120 sec ow Environment Nitrogen 10.72% N/A N/A Nitrogen
19 Zero Defects Process Comparison of Lead Vs Free Lead-Free Tin-lead Baseline o. PWBs Visual Defect Pull Strength PWBs Visual Defect Pull Strength 1 5A Pb B Pb A Pb B A B A B Average
20 Reliability Test Theoretical Thermal Cycling 120 Ram p 10 C/m in Dwell time(20 min.) Temperature in C
21 Pull Test on Ni/Pd SO14 Lead-Free Results after Thermal Cycling Paste S. Finish TAL Soak N2 Board Label Force (lbs) Force (N) Average 1 Sn/Ag/Cu OSP 60sec Yes yes 1A 1B Sn/Ag/Cu OSP 90sec No No 2A 2B Sn/Ag/Cu OSP 120sec No yes 3A 3B Sn/Ag/Cu ENIG 60sec No No 4A 4B Sn/Ag/Cu ENIG 90sec No yes 5A 5B Sn/Ag/Cu ENIG 120sec Yes yes 6A 6B Sn/Ag/Cu OSP 60sec No yes 7A 7B Sn/Ag/Cu OSP 90sec Yes yes 8A 8B Sn/Ag/Cu OSP 120 No No 9A 9B Sn/Bi OSP 60sec No yes 10A 10B Sn/Bi OSP 90sec No yes 11A 11B Sn/Bi OSP 120sec Yes No 12A 12B Sn/Bi ENIG 60sec No yes 13A 13B Sn/Bi ENIG 90sec Yes No 14A 14B Sn/Bi ENIG 120sec No yes 15A 15B Sn/Bi OSP 60sec Yes No 16A 16B Sn/Bi OSP 90sec No yes 17A 17B Sn/Bi OSP 120sec No yes 18A 18B Sn/Ag OSP 60sec No No 19A 19B Sn/Ag OSP 90sec Yes yes 20A 20B Sn/Ag OSP 120sec No yes 21A 21B Sn/Ag ENIG 60sec Yes yes 22A 22B Sn/Ag ENIG 90sec No yes 23A 23B Sn/Ag ENIG 120sec No No 24A 24B Sn/Ag OSP 60sec No yes 25A 25B
22 Pull Test - MIN Before and After Thermal SnAgCu SnBi SnAg OSP ENIG OSP N Air Cycling N Soak Linear Linear Pb OSP Pb ENIG Solder Finish Environment TAL Soak Baseline
23 Conclusions For Zero Defect lead Lead Free Soldering and superior long term Joint Strength, use the following: Materials Lead Free Solder : Sn/Ag/Cu Surface Finish for PWB: ENIG Components Finish: Ni/Pd Processes Reflow Profile: Linear Reflow Environment: Nitrogen Time Above Liquidus: 120 seconds
24 Future Work Consortium Working on 2nd phase: Materials New flux combinations with Sn/Ag/Cu More component types (BGA, QFP s) More Component finishes (Sn, SOP, Immersion) More lead free PWB surface finishes Processes Reflow Environment: Nitrogen or Air Benchmarked with Sn/Pb Lead materials Base
25 Cross Section of Zero Defect Test PWB 10X Mag
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