European Innovation Projects in ECSEL Joint Undertaking Andreas Wild Executive Director Open Innovation Day, Villach, 6 May 2015
Content Nanoelectronics: a KET FP7 Legacy ECSEL First year Next Steps
Nanoelectronics: a KET Electronic Components and Systems: the Smart of Everything Smartphone Smart Card Smart Grid Smart Cities Smart Mobility Smart Governance. Smartanything! Smart = chips running software, integrated in a system, enabling applications! 3
FP7 Legacy ENIAC JU Legacy: Pilot Lines for Power Electronics power electronics on 300mm wafers thinner than paper EPT300 >> EPPL >> eramp
FP7 Legacy ENIAC JU Legacy: Pilot Lines for Power Electronics EPT 300: 23 participations, 4 countries EPPL: 32 participations, 6 countries eramp: 26 participations, 6 countries TOTAL: 91 participation, 9 countries 1 2 4 6 9 10 6 1 1 7 11 9 10 1 1 2
ENIAC JU Legacy: Pilot Lines for Power Electronics Enabling Power Technologies on 300mm wafers Project co-ordinator: Infineon Technologies Austria AG Key project dates: Start: April 2012 Finish: March 2015 Total budget: 43.7 million Enhanced Power Pilot Line Project co-ordinator: Infineon Technologies Austria AG Key project dates: Start: 01.04.2013 Finish: 31.03.2016 Total budget: 74.8 million Excellence in Speed and Reliability for More than Moore Technologies Project co-ordinator: Infineon Technologies Dresden GmbH Key project dates: Start: 01.04.2014 Finish: 31.03.2017 Total budget: 55.2 million This makes Infineon the first company in the world to succeed in taking this step forward... October 10, 2011 Infineon Technologies AG has produced the first chips ( first silicon ) on a 300-millimeter thin wafer for power semiconductors at the Villach site in Austria. Infineon Technologies Dresden GmbH will invest around Euro 250 million for this purpose and will create approx. 250 jobs in Dresden.
ECSEL First Year ECSEL Principles Implement Horizon 2020: Develop favourable conditions for investing in knowledge and innovation Achieve smart, sustainable and inclusive growth Build upon ARTEMIS/ENIAC JU experience: establish an autonomous organization: Joint Undertaking Build upon ARTEMIS/ENIAC JU achievements: 3-way funding The Union (1.17B ) The ECSEL Participating States (>1.17B ) The Private Members (~ 5B, minus grants)
The Past: ECSEL in 2014 ECSEL Multi Annual Strategy Plan 8
ECSEL First Year ECSEL JU Is Focused on Higher Technology Readiness Levels 2014 (ACTUAL) RIA IA TOTAL National eligible costs 150.2 558.1 708.23 National contributions 39.8 104.0 143.7 H2020 eligible costs 145.2 504.6 649.8 EU contributions 48.3 106.7 155.0 European Commission, Brussels, 23.5.2013, COM(2013) 298 final 9
ECSEL First Year ECSEL Calls 2014: Conclusion National Grants EU Grants Call 2014-1: RIA Call 2014-2: IA Initial budget 17.5 42.5 TOTAL 164.5 (104.5 unassigned) Awarded 39.8 104.0 143.7 Initial budget 40 95 135 Awarded 48.3 106.7 155.0 TOTAL GRANTS Awarded 88.0 210.7 298.7 Projects Selected for Funding Eligible costs: 708M (National), 650M (H2020) 3Ccar EXIST MANTIS OSIRIS RobustSense SWARMs ADMONT InForMed POWERBASE R2Power300 SeNaTe WayToGo Fast 48 FPP submissions 12 projects selected Success rate: 1 in 4 10
ECSEL First Year ECSEL Projects Arising from the Calls 2014 ESIF?? 11
An Innovation Action in ECSEL Call 2014-2 A project along the vertical supply chain in advanced power: On GaN: Carrier substrate technologies to improve GaN material quality and reliability Qualified 200mm GaN technology pilot line for high performance normally off power transistors using GaN-on-Silicon epitaxy with advanced process control, high manufacturing stability and yield On Si: Advanced doping materials and processing for high ohmic / low ohmic 300mm silicon substrates for power semiconductors Advanced automation to improve manufacturability in high volume cost competitive fabs On system integration: Dedicated chip embedding pilot line providing advanced packaging solutions to enhance system compatibility Demonstrate results and reliability in leading compact power application domains Significant impact on smart regions: core competences in Carinthia and Styria (Austria), Saxony and Bavaria (Germany) and many other countries.
ECSEL Next Steps 2015 Call Launching Basics 2 Calls, running in parallel RIA IA Two-phase process Project Outline Full Project Proposal Avoid traps: - Large size does not equate to large impact - Buzzwords counterproductive (e.g. huge opportunity ) unless quantified - The economic impact needs context and specificity - The arguments must be compelling for both experts and public authorities In case of equal score, the proposal with higher impact score is ranked higher for both RIA and IA
ECSEL Next Steps Guidance Regarding Proposal Size The Guide for Applicants is clarifying the expectations Proposals of any size are welcome, and will be judged on their merit against published criteria (H2020: excellence, impact, implementation) The PAB expects compelling motivations for proposals requesting EU contributions approaching or exceeding 1/4 (RIA), respectively 1/3 (IA) of the EU budget available for the call
WP 2015 Public Contributions EU Contributions Indicative Budgets and Reimbursement Rates (H2020 Eligible Cost) RIA EU Estimated Expenditure: 50M Research and Innovation Actions Centre of Gravity TRL 3-4 Large Industry 25% SME 30% University/RTO 40% IA EU Estimated Expenditure: 95M Innovation Actions Centre of Gravity TRL 5-8 Large Industry 15% SME 25% University/RTO 40% National Contributions: Same Total Amount Envisaged Reimbursement as per national rules (see WP2015) 15
ECSEL Next Steps GB: Adopt WP2015 GB Meeting PAB Funding Decision PROJECT START PAB Meeting GRANT AGREEMENTS Provisional Timeline 2015 EU and NFA pre-commitments*. EU and NFA contribution adjustments Fix Contributions *: under caveat: pending budgetary authorities decision Call(s) open 17 March PO closed 12 May FPP closed 8 Sep jan feb mar apr may jun jul aug sep oct nov dec Public Authorities Working Group: - Rules evaluation /selection (rating steps) - Launch of calls 2015 Call Launch Event and Consortium Building: 14/15 tbc Possibly: 2nd Consortium Building? Evaluation by Experts Corrections by NFAs
Definition ECSEL JU: an Inclusive Programme Permeating virtually all industrial branches and aspects of societal life Bringing together Union with the Participating States and the private sector Allowing participation of large and small countries, of regions Supporting the whole ecosystem: Sequoia (large) Normal trees (medium-sized) Bushes (small) Grass-root innovation (institutional / academic research) Naturally able to combine funding sources (e.g.h2020 +National, + ESIF etc.) 17
ECSEL Next Steps The Tripartite Joint Undertaking: a Mechanisms among Many Industry CATRENE, ITEA3, ΣURIPIDES2, CELTIC+, EUROGIA+, ACQUEA, National Programmes EUREKA Clusters JTIs /JUs BBI, Clean Sky, FCH, IMI Contractual PPPs FP7/H2020 Calls EeB, FoF, SPIRE, EGVI, Photonics, Robotics, HPC, 5G Member States? Smart Specialization ESIF/ERDF Regions
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Combining Funding: a Unique 3-Way Mechanism Co-Funding Possibilities 4. Parallel ESIF Private: >50%* National: 25%* EU: 25%* 2. Preparatory ESIF R&I Phase 1. Included ESIF Industrial Phase 3. Subsequent ESIF *: percentages for illustration only, actual value will vary according to different criteria 20